In-situ analysis of the microstructure of thermally treated thin copper films

Materials Research Society Symposium Proceedings

Volumn 309, Issue , 1993, Pages 377-382

  Nucci, J ^a   Neves, H ^a   Shacham, Y ^a   Eisenbraun, E ^a   Zheng, B ^a   Kaloyeros, A ^a  

^a Department of Molecular Biology and Genetics   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRON DIFFRACTION; HEAT TREATMENT; INTEGRATED CIRCUITS;

COPPER LINE THERMAL EVOLUTION; INTEGRATED CIRCUIT METALLIZATION; THERMALLY TREATED THIN COPPER FILMS;

COPPER;

EID: 0027914995     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1557/proc-309-377     Document Type: Conference Paper

References (15)