Use of voltage stressing at wafer probe for reliability predictions

IEEE Transactions on Semiconductor Manufacturing

Volumn 12, Issue 4, 1999, Pages 516-522

  London, Arnie ^a,b   Ng, Kenny ^c   Wick, Paul ^d  

^a IEEE

^b Vishay Siliconix ^*

^c WESTERN DIGITAL CORPORATION   (United States)

^d Adaptec Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRIC POTENTIAL; RELIABILITY; STRESSES;

VOLTAGE STRESSING;

INTEGRATED CIRCUIT MANUFACTURE;

EID: 0033350554     PISSN: 08946507     EISSN: None     Source Type: Journal    
DOI: 10.1109/66.806129     Document Type: Article

References (9)

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