Diallyl bisphenol a ether and diallyl phenyl ether modified bismaleimide resin system for resin transfer molding

Journal of Applied Polymer Science

Volumn 74, Issue 7, 1999, Pages 1649-1653

  Zhongming, Li ^a   Ming, Xu ^a   Ai, Lu ^a   Meidong, Zhang ^a   Rui, Huang ^a  

^a SICHUAN UNIVERSITY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

COMPOSITE MATERIALS; CURING; DIFFERENTIAL SCANNING CALORIMETRY; GELS; HEAT RESISTANCE; SHEAR STRENGTH; TEMPERATURE; THERMODYNAMIC STABILITY; THERMOOXIDATION; TRANSFER MOLDING; VISCOSITY;

BISMALEIMIDE RESIN SYSTEM; PROCESSING BEHAVIOR; RESIN TRANSFER MOLDING;

EPOXY RESINS;

EID: 0033339606     PISSN: 00218995     EISSN: None     Source Type: Journal    
DOI: 10.1002/(SICI)1097-4628(19991114)74:7<1649::AID-APP6>3.0.CO;2-6     Document Type: Article

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