Modification of BMI with allyl compounds

Journal of Advanced Materials

Volumn 27, Issue 2, 1996, Pages 61-64

  Guozheng, L ^a   Aijuan, G ^a,b,c   Liwen, L ^a,b,d  

^a NORTHWESTERN POLYTECHNICAL UNIVERSITY   (China)

^b NPU ^*

^c East China Technical Institute   (China)

^d SUN YAT SEN UNIVERSITY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

AGING OF MATERIALS; CHEMICAL MODIFICATION; COPOLYMERS; HEAT RESISTANCE; MECHANICAL PROPERTIES; MELTING; ORGANIC SOLVENTS; SOLUBILITY; THERMODYNAMIC PROPERTIES; TOUGHNESS; VISCOSITY; WATER ABSORPTION;

ALLYL COMPOUNDS; BISMALEIMIDE COMPOUNDS; HEAT DEFLECTION TEMPERATURE; HOT WET PROPERTIES; REACTIVITY;

ORGANIC COMPOUNDS;

EID: 0029757202     PISSN: 10709789     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (5)

1. J.J King, M. Chaudhari, S. Zahir, "A New Bismaleimide System for High Performance Applications," 29th National SAMPE Symposium, 392 (1984).
2. K.D. Potter, F.C. Robertson, "Bismaleimide Formulations for Resin Transfer Moulding," 32nd Int'l SAMPE Symposium, 1 (1987).
3. H.D. Stenzenberger, et.al., "The Development of Tough Bismaleimide Resins," 31st Int'l SAMPE Symposium, 920 (1986).
4. L. Guozheng, et.al., Polymeric Materials Science and Engineering, 7 (2) 95 (1991).
5. Chinese Patent, No. 93119037. 1.