Polyimides in high-performance electronics packaging and optoelectronic applications

Polyimides: Fundamentals and Applications

Volumn , Issue , 2018, Pages 759-814

  Feger, Claudius ^a   Franke, Hilmar ^b  

^a IBM T J WATSON RESEARCH CENTER   (United States)

^b UNIVERSITY OF DUISBURG ESSEN   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINA; ALUMINUM OXIDE; CERAMIC MATERIALS; CHIP SCALE PACKAGES; DIELECTRIC MATERIALS; ELECTRONICS INDUSTRY; MECHANICAL PROPERTIES; POLYIMIDES; SILICA;

ELECTRONIC PACKAGE; HIGH DIELECTRIC CONSTANTS; HIGH PERFORMANCE APPLICATIONS; INORGANIC MATERIALS; LOW DIELECTRIC CONSTANTS; MAINFRAME COMPUTER; MULTILAYER CERAMIC PACKAGE; OPTOELECTRONIC APPLICATIONS;

MILITARY APPLICATIONS;

EID: 84984595674     PISSN: None     EISSN: None     Source Type: Book    
DOI: 10.1201/9780203742945     Document Type: Chapter

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