Development of a novel air-back wafer carrier with an integrated endpoint detector for copper CMP application

1999 IEEE International Symposium on Semiconductor Manufacturing, ISSM 1999 - Conference Proceedings

Volumn , Issue , 1999, Pages 183-186

  Sakai, K ^a   Doy, T K ^b   Touzov, M M ^a   Satoh, M ^a   Kasai, T ^b  

^a Tokyo Seimitsu Company Limited   (Japan)

^b Sailatnil University   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

CHEMICAL MECHANICAL POLISHING; COPPER; MANUFACTURE; POLISHING; SEMICONDUCTOR DEVICE MANUFACTURE; CHEMICAL POLISHING; DETECTORS; ELECTRIC TRANSFORMERS; OXIDES; SIGNAL TO NOISE RATIO;

COPPER WAFER; END-POINT DETECTORS; LINEAR VARIABLE DIFFERENTIAL TRANSFORMER; MULTI-STEP; NON-UNIFORMITIES; PATTERNED WAFERS; PROCESS PERFORMANCE; WAFER CARRIER;

SILICON WAFERS; SEMICONDUCTOR DEVICE MANUFACTURE;

AIR-BACK POLISHING CARRIERS; CHEMICAL-MECHANICAL POLISHING (CMP); ENDPOINT DETECTORS; LINEAR VARIABLE DIFFERENTIAL TRANSFORMERS (LVDT); SEMICONDUCTOR WAFERS;

EID: 0033334805     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ISSM.1999.808767     Document Type: Conference Paper

References (1)

1. T. K. Doy et til: "Global Planarization TechiiiqidCMP hy High Prccision Polishing and Its Characteristics" in 1'ror.eedirrg.s of the ISSM'95 Conferewe, PP 214.217