Global planarization technique/CMP by high precision polishing and its characteristics

IEEE International Symposium on Semiconductor Manufacturing Conference Proceedings

Volumn , Issue , 1995, Pages 214-217

  Karaki Doy, Toshiroh ^a   Jeong, Haedo ^b   Nakagawa, Takeo ^b   Ohmori, Hitoshi ^c   Kasai, Toshio ^a  

^a SAITAMA UNIVERSITY   (Japan)

^b INSTITUTE OF INDUSTRIAL SCIENCE   (Japan)

^c INST OF PHYS AND CHEMICAL RESEARCH   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 84866324236     PISSN: 1523553X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ISSM.1995.524394     Document Type: Conference Paper

References (0)