Laser (UV) microvia application in cellular technology

Circuit World

Volumn 26, Issue 1, 1999, Pages 11-15

  Raman, Sudhakar ^a   Jeong, Jae Hun ^a   Kim, Sang Jin ^a   Sun, Ben ^a   Park, Keon Yang ^a  

^a NONE

Author keywords

[No Author keywords available]

Indexed keywords

CELLULAR TELEPHONE SYSTEMS; LASERS; ULTRAVIOLET RADIATION;

MICROVIA;

PRINTED CIRCUIT BOARDS;

EID: 0033329707     PISSN: 03056120     EISSN: None     Source Type: Journal    
DOI: 10.1108/03056120010302142     Document Type: Article

References (7)

1. Brannon, J. (1993), Excimer Laser Ablation & Etching, American Vacuum Society Monograph.
2. Cable, A. (1997), "Improvement in high speed laser microvia formation using solid state Nd: YAG UV lasers", IPC Works'97, High Density Interconnects Conference, 5-9 October.
3. Nakahara, H. (1998), "The Japanese PCB industry", PC FAB, October.
4. Owen, M. (1997), "Eliminating X-ray alignment, desmear, and electroless copper process steps using UV YAG laser drilled microvias", IPC Expo'97.
5. Petefish, W.G., Noddin, D., Hanson, D., Gorrell, R. and Sylvester, M. (1998), "High density organic flip chip package substrate technology", 48th Electronic Components & Technology Conference 1998.
6. Srinivasan, R. (1994), "Interaction of laser radiation with organic polymers", Laser Ablation, Springer Series in Material Science, Vol. 28.
7. Znotins, T., Poulin, D. and Reid, J. (1997), "Excimer laser: an emerging technology in the electronic industry", IPC Fall Meeting, October.