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Volumn 13, Issue 4, 1999, Pages 529-536

Aircraft skin-cooling system for thermal management of onboard high-power electronics

Author keywords

[No Author keywords available]

Indexed keywords

AIR CONDITIONING; AVIONICS; CABINS (AIRCRAFT); FUSELAGES; HEAT LOSSES; MATHEMATICAL MODELS; THERMAL LOAD;

EID: 0033321261     PISSN: 08878722     EISSN: None     Source Type: Journal    
DOI: 10.2514/2.6472     Document Type: Article
Times cited : (4)

References (9)
  • 1
    • 0029722220 scopus 로고    scopus 로고
    • High-power electronics heat rejection from aircraft skin
    • Dyson, E., Hashemi, A., and Wong, H., "High-Power Electronics Heat Rejection from Aircraft Skin," Journal of Enhanced Heat Transfer, Vol. 3, No. 3, 1996, pp. 165-176.
    • (1996) Journal of Enhanced Heat Transfer , vol.3 , Issue.3 , pp. 165-176
    • Dyson, E.1    Hashemi, A.2    Wong, H.3
  • 2
    • 0343810129 scopus 로고
    • Cooling of onboard high-power electronics using augmented heat rejection from aircraft skin
    • edited by R. O. Buckius, Office of Printing Services, Univ. of Illinois, Urbana-Champaign, IL
    • Hashemi, A., Dyson, E., and Wong, H., "Cooling of Onboard High-Power Electronics Using Augmented Heat Rejection from Aircraft Skin," Proceedings of the Symposium on Thermal Science and Engineering in Honor of Chancellor Chang-Lin Tien, edited by R. O. Buckius, Office of Printing Services, Univ. of Illinois, Urbana-Champaign, IL, 1995, pp. 465-474.
    • (1995) Proceedings of the Symposium on Thermal Science and Engineering in Honor of Chancellor Chang-lin Tien , pp. 465-474
    • Hashemi, A.1    Dyson, E.2    Wong, H.3


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.