High-power electronics heat rejection from aircraft skin

Journal of Enhanced Heat Transfer

Volumn 3, Issue 3, 1996, Pages 165-176

  Dyson, Elizabeth ^a   Hashemi, Ab ^b   Wong, Hubert ^b  

^a Lockheed Martin Canada   (Canada)

^b LOCKHEED MARTIN   (United States)

Author keywords

Aircraft; CFD; Electronic equipment; Heal rejection

Indexed keywords

AIRCRAFT PARTS AND EQUIPMENT; COMPUTER SIMULATION; FLUID DYNAMICS; HEAT CONVECTION; HEAT RADIATION; HEAT TRANSFER; HEAT TRANSFER COEFFICIENTS; TURBULENCE;

COMPUTATIONAL FLUID DYNAMICS; HEAT REJECTION; HIGH-POWER ELECTRONICS;

ELECTRONIC EQUIPMENT;

EID: 0029722220     PISSN: 10655131     EISSN: None     Source Type: Journal    
DOI: 10.1615/JEnhHeatTransf.v3.i3.10     Document Type: Article

References (6)

1. Hashemi, A., Wong, H. and Dyson, E., 1994. EST Challenger Skin Cooling: Fluid Flow and Heat Transfer, Lockheed Missiles and Space Company, Inc., LMSC-P108691.
2. Incropera, E. P. and Devitt, D. P., Fundamentals of Heat and Mass Transfer, Third Edition, 1990, John Wiley and Sons, New York.
3. Kelkar, K. M. and Patankar, S. V., 1987. Numerical Prediction of Flow and Heat Transfer in a Parallel Plate Channel With Staggered Fins, ASME Journal of Heat Transfer, Vol. 109, pp. 25-30.
4. Patankar, S. V., 1980. Numerical Heat Transfer and Fluid Flow, McGraw-Hill Book Company, New York.
5. Sparrow, E. M. and Patankar, S.V., 1990. Relationship Among Boundary Conditions and Nusselt Numbers for Thermally Developed Flows, ASME Transaction, Journal of Heat Transfer, Vol. 99, pp. 483-485, August 1977.
6. Documentation of COMPACT, Innovative Research, Inc., Minneapolis, MN.