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Volumn , Issue , 1997, Pages 256-263
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Lifetime assessment of soft solder joints on the base of the metallurgical behaviour of Sn62Pb36Ag2
a
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Author keywords
[No Author keywords available]
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Indexed keywords
CRACK PROPAGATION;
DISLOCATIONS (CRYSTALS);
GRAIN BOUNDARIES;
SOLDERING ALLOYS;
SURFACE MOUNT TECHNOLOGY;
THERMAL CYCLING;
THERMAL GRADIENTS;
TIN ALLOYS;
TIN METALLURGY;
VISCOPLASTICITY;
DISLOCATION CLIMB;
GRAIN BOUNDARY SLIDING;
SOLDERED JOINTS;
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EID: 0031336323
PISSN: None
EISSN: None
Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper |
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Times cited : (2)
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References (9)
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