Building neural network equipment models using model modifier techniques

IEEE Transactions on Semiconductor Manufacturing

Volumn 12, Issue 3, 1999, Pages 377-381

  Marwah, Manish ^a   Mahajan, Roop L ^b  

^a QUALCOMM INC   (United States)

^b University of Colorado at Boulder   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CHEMICAL VAPOR DEPOSITION; COMPUTER SIMULATION; DESIGN; MODELS; NEURAL NETWORKS;

DIFFERENCE METHOD; EQUIPMENT MODELS; MODEL MODIFIER TECHNIQUES; NEURAL NETWORK TRANSFER; PHYSICAL NEURAL NETWORK MODELS; SOURCE INPUT METHOD;

SEMICONDUCTOR DEVICE MANUFACTURE;

EID: 0033316051     PISSN: 08946507     EISSN: None     Source Type: Journal    
DOI: 10.1109/66.778208     Document Type: Article

References (20)

1. N. V. Bhat and T. J. McAvoy, "Determining model structure for neural models by network stripping," Comput. Chem. Eng., vol. 16, no. 4, p. 271, 1992.
2. F. C. Eversteyn, P. J. W. Severin, C. H. J. V. D. Brekel, and H. L. Peck, "A stagnation layer model for the epitaxial growth of silicon from silane in a horizontal reactor," J. Electrochem. Soc., vol. 117, no. 7, pp. 925-931, 1970.
3. S. S Han, M. Ceiler, S. A. Bidstrup, P. Kohl, and G. S. May, "Modeling the properties of PECVD silicon dioxide films using optimized back-propagation neural networks," IEEE Trans. Comp., Packag., Manufact. Technol. A, vol. 17, no. 2, p. 174, 1994.
4. S. Haykin, Neural Networks: A Comprehensive Foundation. New York: Macmillan, 1993.
5. M. Hornik, M. Stinchcombe, and H. White, "Multilayer feed forward networks are universal approximations," Neural Networks, vol. 2, p. 359, 1989.
6. A. S. Kelkar, R. L. Mahajan, and R. L. Sani, "Real-time physico-neural solutions for MOCVD," ASME-J. Heat Transfer, vol. 118, p. 814, 1996.
7. B. Kim and G. S. May, "An optimal neural network process model for plasma etching," IEEE Trans. Semiconduct. Manufact., vol. 7, pp. 12-21, Feb. 1994.
8. Z. Nami, O. Misman, A. Erbil, and G. S. May, "Semi-emperical neural network modeling of metal-organic chemical vapor deposition" IEEE Trans. Semiconduct. Manufact., vol. 10, pp. 288-294, May 1997.
9. R. L. Mahajan, "Transport phenomena in chemical vapor deposition systems," Advances in Heat Transfer. San Diego, CA: Academic, 1996, vol. 28, pp. 339-415.
10. R. L. Mahajan and K. C. Gupta, "Physical-neural network modeling for electronic packaging applications," in Proc. Wireless Communications Conf., Boulder, CO, Aug. 19-21, 1996, pp. 157-162.
11. R. L. Mahajan and X. A. Wang, "Neural network models for thermally based microelectronic manufacturing processes," J. Electrochem. Soc., vol. 140, no. 8, p. 2287, 1993.
12. R. L. Mahajan and C. Wei, "Buoyancy, Soret, Dufour and variable property effects in silicon epitaxy," ASME J. Heat Transf., vol. 113, p. 688, 1991.
13. M. Marwah, R. L. Mahajan, and Y. Li, "Integrated neural network modeling for electronics manufacturing," J. Electron. Manufact., vol. 118, p. 148, 1996.
14. M. Marwah, "Neural network modeling techniques for selected electronic manufacturing processes," M.S. thesis, Univ. Colorado, Boulder, 1996.
15. J. L. McClelland and D. E. Rumelhart, Parallel Distribution Processing. Cambridge, MA: MIT Press, 1986.
16. D. C. Montgomery, Design and Analysis of Experiments. New York: Wiley, 1991.
17. L. Y. Pratt, "Transferring previously learned back propagation neural networks to new learning tasks," Ph.D. dissertation, Rutgers Univ., Piscataway, NJ, 1993.
18. M. Smith, Neural Networks for Statistical Modeling. New York: Van Nostrand Reinhold, 1989.
19. G. Subbarayan, Y. Li, and R. L. Mahajan, "Reliability simulations for solder joints using stochastic finite element and artificial neural network models," ASME J. Electron. Packag., vol. 118, no. 3, p. 148, 1996.
20. P. D. Wasserman, Neural Computing: Theory and Practice. New York: Van Nostrand Reinhold, 1989.