A model for optimizing the assembly and disassembly of electronic systems

IEEE Transactions on Electronics Packaging Manufacturing

Volumn 22, Issue 2, 1999, Pages 105-117

  Sandborn, Peter A ^a,b   Murphy, Cynthia F ^c  

^a IEE ^*  (United States)

^b UNIVERSITY OF MARYLAND   (United States)

^c Microelectronics Computer Technology Corporation   (United States)

Author keywords

Design for environment; Design to cost; Disassembly; Electronics product take back; End of life; Recycling; Virtual prototyping

Indexed keywords

COMPUTER SIMULATION; DECISION SUPPORT SYSTEMS; DECISION THEORY; ENVIRONMENTAL PROTECTION; LIFE CYCLE; MATHEMATICAL MODELS; MONTE CARLO METHODS; OPTIMIZATION; PROCESS ENGINEERING; PRODUCT DESIGN; RAPID PROTOTYPING; RECYCLING;

DESIGN-FOR-ENVIRONMENT; DESIGN-TO-COSTS; ELECTRONICS PRODUCT TAKE-BACK;

ELECTRONICS PACKAGING;

EID: 0033310476     PISSN: 1521334X     EISSN: None     Source Type: Journal    
DOI: 10.1109/6104.778170     Document Type: Article

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