Investigation of electronic assembly design alternatives through production modeling of life cycle impacts, costs, and yield

IEEE transactions on components, packaging and manufacturing technology. Part C. Manufacturing

Volumn 20, Issue 4, 1997, Pages 317-326

  Stuart, J A ^a   Turbini, L J ^a   Ammons, J Ch ^a  

^a OHIO STATE UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; COST ACCOUNTING; ENVIRONMENTAL IMPACT; MANUFACTURE; MATHEMATICAL MODELS; SERVICE LIFE; SOLDERING ALLOYS;

PROCESS DESIGN;

PRINTED CIRCUIT DESIGN;

EID: 0031251548     PISSN: 10834400     EISSN: None     Source Type: Journal    
DOI: 10.1109/3476.650964     Document Type: Article

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