Surface graft copolymerization enhanced adhesion of an epoxy-based printed circuit board substrate (FR-4) to copper

IEEE Transactions on Advanced Packaging

Volumn 22, Issue 2, 1999, Pages 214-220

  Liu, Y X ^a   Kang, E T ^a   Neoh, K G ^a   Zhang, J F ^a   Cui, C Q ^a   Lim, Thiam Beng ^a  

^a NATIONAL UNIVERSITY OF SINGAPORE   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; ARGON; COMPOSITION EFFECTS; COPOLYMERIZATION; COPPER; EPOXY RESINS; GLASS FIBER REINFORCED PLASTICS; GRAFT COPOLYMERS; INTERFACES (MATERIALS); PRINTED CIRCUIT DESIGN; SUBSTRATES; X RAY PHOTOELECTRON SPECTROSCOPY;

GRAFT COPOLYMERIZATION; PLASMA TREATMENT;

ELECTRONICS PACKAGING;

EID: 0033309769     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/6040.763194     Document Type: Article

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