Modification of substrate surface for BGA overmold adhesion enhancement by graft copolymerization

Materials Research Bulletin

Volumn 31, Issue 11, 1996, Pages 1361-1373

  Wang, Tie ^a   Kang, E T ^a   Neoh, K G ^a   Tan, K L ^a   Cui, C Q ^a   Chakravorty, K K ^a   Lim, T B ^a  

^a NATIONAL UNIVERSITY OF SINGAPORE   (Singapore)

Author keywords

A. electronic materials; A. interfaces; C. photoelectron spectroscopy; D. mechanical properties

Indexed keywords

ADHESION; COMPOSITION; COPOLYMERIZATION; ELECTRONICS PACKAGING; EPOXY RESINS; GRAFTING (CHEMICAL); OZONE; STRUCTURE (COMPOSITION); SUBSTRATES; THERMAL EFFECTS; ULTRAVIOLET RADIATION; X RAY PHOTOELECTRON SPECTROSCOPY;

BALL GRID ARRAY; EPOXY MOLDING COMPOUND; GRAFT COPOLYMERIZATION; MICROELECTRONICS PACKAGING; OZONE PRETREATMENT;

SURFACE TREATMENT;

EID: 0030286019     PISSN: 00255408     EISSN: None     Source Type: Journal    
DOI: 10.1016/0025-5408(96)00127-4     Document Type: Article

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