Experiments on low velocity cooling of high conductivity substrates

IEEE Transactions on Components and Packaging Technologies

Volumn 22, Issue 2, 1999, Pages 307-315

  Sikka, Kamal K ^a   Torrance, Kenneth E ^a   Fisher, Timothy S ^a  

^a IBM   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINA; ALUMINUM ALLOYS; APPROXIMATION THEORY; COOLING; MIXED CONVECTION; SUBSTRATES; THERMAL CONDUCTIVITY OF SOLIDS; THERMAL EFFECTS;

CONJUGATE MIXED CONVECTION; HEAT SPREADING; LOW VELOCITY COOLING;

ELECTRONICS PACKAGING;

EID: 0033308615     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/6144.774750     Document Type: Article

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