Investigative study of manifold microchannel heat sinks for electronic cooling design

Journal of Electronics Manufacturing

Volumn 9, Issue 2, 1999, Pages 155-166

  Ng, E Y K ^a   Poh, S T ^a  

^a NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTATIONAL FLUID DYNAMICS; COOLING; HEAT TRANSFER; MATHEMATICAL MODELS;

MANIFOLD MICROCHANNEL HEAT SINKS;

HEAT SINKS;

EID: 0033296704     PISSN: 09603131     EISSN: None     Source Type: Journal    
DOI: 10.1142/S0960313199000088     Document Type: Article

References (22)

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