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Volumn 35, Issue SUPPL. 4, 1999, Pages

A study on the characteristics of the interlayer low dielectric polyimide during cl-based plasma etching of aluminum

Author keywords

[No Author keywords available]

Indexed keywords


EID: 0033271557     PISSN: 03744884     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article
Times cited : (3)

References (9)
  • 3
    • 0019927436 scopus 로고
    • Polymer Materials for Electronic Applications, edited by E. D. Feit and C. W. Wilkins, Jr. American Chemical Society, Washington, D. C.
    • Y. K. Lee and J. D. Craig, in Polymer Materials for Electronic Applications, edited by E. D. Feit and C. W. Wilkins, Jr. (ACS Symposium Series, American Chemical Society, Washington, D. C., 1982), Vol. 184, p. 107.
    • (1982) ACS Symposium Series , vol.184 , pp. 107
    • Lee, Y.K.1    Craig, J.D.2


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.