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Volumn 35, Issue SUPPL. 4, 1999, Pages
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A study on the characteristics of the interlayer low dielectric polyimide during cl-based plasma etching of aluminum
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Author keywords
[No Author keywords available]
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Indexed keywords
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EID: 0033271557
PISSN: 03744884
EISSN: None
Source Type: Journal
DOI: None Document Type: Article |
Times cited : (3)
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References (9)
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