Analysis of 3-D interconnect structures with PEEC using SPICE

IEEE Transactions on Electromagnetic Compatibility

Volumn 41, Issue 4 PART 2, 1999, Pages 412-417

  Wollenberg, Günter ^a   Görisch, André ^a  

^a OTTO VON GUERICKE UNIVERSITY   (Germany)

Author keywords

EMC; PEEC; Simulation; SPICE

Indexed keywords

COMPUTER SIMULATION; COMPUTER SOFTWARE; ELECTRIC FIELD EFFECTS; ELECTRIC NETWORK ANALYSIS; EQUIVALENT CIRCUITS; MATHEMATICAL MODELS;

PARTIAL ELEMENT EQUIVALENT CIRCUITS (PEEC); SOFTWARE PACKAGE SPICE;

INTERCONNECTION NETWORKS;

EID: 0033220933     PISSN: 00189375     EISSN: None     Source Type: Journal    
DOI: 10.1109/15.809841     Document Type: Article

References (7)

1. A. E. Ruehli, "Equivalent circuit models for three-dimensional multiconductor systems," IEEE Trans. Microwave Theory Tech., vol. MTT-22, pp. 216-221, Mar. 1974.
2. A. E. Ruehli and H. Heeb, "Circuit models for three-dimensional geometrices including dielectrics," IEEE Trans. Microwave Theory Tech., vol. 40, pp. 1507-1516, July 1992.
3. A. E. Ruehli, J. Garrett, and C. Paul, "Circuit models for 3-D structures with incident fields," in IEEE Int. Symp. Electromagn. Compat., Dallas TX, Aug. 1993, pp. 28-32.
4. S. K. Kundert, The Designers Guide to SPICE and SPECTRE. Norwell, MA: Kluwer, 1995.
5. E.-H. Horneber, Simulation Elektrischer Schaltungen auf dem Rechner. Berlin, Germany: Springer-Verlag, 1985.
6. G. Wollenberg and A. Görisch, "Coupling of PEEC models with transmission line models for simulation of wiring structures," in Proc. IEEE Int. EMC Symp., Seattle, WA, Aug. 1999, pp. 848-853.
7. W. Pinello, A. C. Cangellaris, and A. Ruehli, "Hybrid electromagnetic modeling of noise interactions in packaged electronics based on the partial element equivalent circuit formulation," IEEE Trans. Microwave Theory Tech. vol. 45, pp. 1889-1896, Oct. 1997.