Characterization of SiO2 surface treatments using AFM, contact angles and a novel dewpoint technique

Colloids and Surfaces A: Physicochemical and Engineering Aspects

Volumn 154, Issue 1-2, 1999, Pages 33-51

  Eske, Lance D ^a   Galipeau, David W ^b  

^a South Dakota State University   (United States)

^b NONE

Author keywords

Dewpoint error technique; Oxygen argon sputtering; Quartz; SiO2 characterization

Indexed keywords

ACETIC ACID; ATOMIC FORCE MICROSCOPY; CONTACT ANGLE; HYDROGEN INORGANIC COMPOUNDS; INTERFACIAL ENERGY; ORGANIC ACIDS; POTASSIUM COMPOUNDS; SODIUM COMPOUNDS; SPUTTERING; SURFACE ROUGHNESS; SURFACE TREATMENT;

CHROMIC ACID; CONTACT ANGLE MEASUREMENTS; DEWPOINT ERROR TECHNIQUE; PIRANHA ETCH;

SILICA;

ACETIC ACID; ARGON; CHROMIC ACID; GLASS; HYDROCHLORIC ACID; OXYGEN; POTASSIUM HYDROXIDE; SILICON DIOXIDE; SODIUM HYDROXIDE;

ATOMIC FORCE MICROSCOPY; CONFERENCE PAPER; CONTACT ANGLE; ENERGY; HYSTERESIS; PRIORITY JOURNAL; SURFACE PROPERTY; SURFACE TENSION; TECHNIQUE; THEORY;

EID: 0033180938     PISSN: 09277757     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0927-7757(98)00907-8     Document Type: Conference Paper

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