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Volumn 346, Issue 1, 1999, Pages 169-173

Stacking faults and their strain effect at the Si/SiO2 interfaces of a directly bonded SOI (silicon on insulator)

Author keywords

[No Author keywords available]

Indexed keywords

BONDING; ELECTRON DIFFRACTION; INTERFACES (MATERIALS); SILICA; SILICON; SINGLE CRYSTALS; STACKING FAULTS; STRAIN; THERMOOXIDATION; TRANSMISSION ELECTRON MICROSCOPY;

EID: 0033149168     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0040-6090(98)01468-0     Document Type: Article
Times cited : (4)

References (14)
  • 6
    • 85031626848 scopus 로고    scopus 로고
    • Bonded silicon on insulator technologies
    • Kyungju, Korea, 1996, Research Institute of Science and Technology (RIST), Korea
    • R.A. Craven, Bonded silicon on insulator technologies, in Proc. 3rd Workshop on Wafer Cleaning and Sufrace Characterization, Kyungju, Korea, 1996, Research Institute of Science and Technology (RIST), Korea, 1996, p. 323.
    • (1996) Proc. 3rd Workshop on Wafer Cleaning and Sufrace Characterization , pp. 323
    • Craven, R.A.1
  • 12


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.