Silicon-On-Insulator by Wafer Bonding: A Review

Journal of the Electrochemical Society

Volumn 138, Issue 1, 1991, Pages 341-347

  Maszara, W P ^a  

^a HONEYWELL   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BONDING - DISSIMILAR MATERIALS; DIELECTRIC MATERIALS - BONDING; SEMICONDUCTING FILMS - ELECTRIC PROPERTIES; SEMICONDUCTOR DEVICE MANUFACTURE - SILICON ON INSULATOR TECHNOLOGY;

BONDING KINETICS; WAFER BONDING;

SEMICONDUCTING SILICON;

EID: 0026003541     PISSN: 00134651     EISSN: 19457111     Source Type: Journal    
DOI: 10.1149/1.2085575     Document Type: Article

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