Thermal contact resistance across a copper-silicon interface

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 3151, Issue , 1997, Pages 45-51

  Khounsary, Ali M ^a   Chojnowski, David ^a   Assoufid, Lahsen ^a   Worek, William M ^b  

^a ARGONNE NATIONAL LABORATORY   (United States)

^b University of Illinois at Chicago   (United States)

Author keywords

Contact resistance; Heat transfer; Thermal interface

Indexed keywords

CONTACT RESISTANCE; COPPER; ELECTROMAGNETIC WAVES; EUTECTICS; GALLIUM; HEAT EXCHANGERS; HEAT FLUX; HEAT RESISTANCE; HEAT TRANSFER; INDIUM; LIQUID METALS; MATERIALS; ORGANIC POLYMERS; SILICON; SILVER; SYNCHROTRON RADIATION; SYNCHROTRONS; THERMAL CONDUCTIVITY OF LIQUIDS; THERMAL CONDUCTIVITY OF SOLIDS; THERMOANALYSIS; THERMONUCLEAR REACTIONS; TIN;

CONTACT CONDUCTANCE; INTERFACE PRESSURE; MATE RIAL PROPERTIES; SILICON INTERFACES; SOLID INTERFACES; THERMAL INTERFACE;

PHASE INTERFACES;

EID: 0003037257     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.294497     Document Type: Conference Paper

References (4)

1. Asano, M, J. Ogata, and Y. Yosinaga, "Quantitative evaluation of contact thermal conductance in a vacuum as a result of simulating the effect of cooling," in High Heat Flux Engineering, Proc. SPIE 1793, pp. 652-656, 1993.
2. Kennard, E. H. Kinetic Theory of Gases, McGraw-Hill, New York, pp. 311-318, 1938.
3. Lambert, M. A., and Fletcher, L. S., "Review of Models for Thermal Contact Conductance of Metals," AIAA Journal of Thermophysics and Heat Transfer, Vol. 11, No. 2, pp. 129-140, 1997.
4. Yovanovich, M. M., and V. W. Antonetti, "Application of thermal contact resistance theory to electronic packages," in Advances in Thermal Modeling of Electronic Components and Systems, Vol. 1, A. Bar-Cohen and A. D. Kraus, Editors, pp. 79-128, Hemisphere Publishing Corp., New York, 1988.