Process and equipment simulation of copper chemical vapor deposition using Cu(hfac)vtms

Microelectronic Engineering

Volumn 45, Issue 1, 1999, Pages 15-27

  Wolf, H ^a   Rober J ^a   Riedel, S ^a   Streiter, R ^a   Gessner, T ^a  

^a CHEMNITZ UNIVERSITY OF TECHNOLOGY   (Germany)

Author keywords

Copper metallization; CVD; Simulation

Indexed keywords

ARGON; COMPUTATIONAL FLUID DYNAMICS; COMPUTER SIMULATION; COPPER; COPPER COMPOUNDS; METALLIZING; METALLORGANIC CHEMICAL VAPOR DEPOSITION; OPTIMIZATION;

COPPER HEXAFLUOROACETYLACETONE VINYLTRIMETHYLSILANE;

METALLIC FILMS;

EID: 0033075656     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0167-9317(98)00257-3     Document Type: Article

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