Microstructuring of conducting polymers

Electrochimica Acta

Volumn 44, Issue 12, 1999, Pages 1847-1864

  Schultze, J W ^a   Morgenstern, T ^a   Schattka, D ^a   Winkels, S ^a  

^a HEINRICH HEINE UNIVERSITY   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ASPECT RATIO; ELECTROCHEMISTRY; ELECTRONIC PROPERTIES; GROWTH (MATERIALS); LASER APPLICATIONS; MICROANALYSIS; MICROSTRUCTURE; NUCLEATION; OPTICAL PROPERTIES; POLYMERIZATION; PRINTED CIRCUIT BOARDS; STOICHIOMETRY;

THROUGH-HOLE PLATING;

CONDUCTIVE PLASTICS;

EID: 0032732496     PISSN: 00134686     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0013-4686(98)00326-0     Document Type: Review

References (63)

1. Jonas F., Heywang G. Electrochim. Acta. 39:1994;1345.
2. Hupe J., Wolf G-D., Jonas F. Galvanotechnik. 86:1995;3404.
3. Meyer H., Nichols R.J., Schröer D., Stamp L. Electrochim. Acta. 39:1994;1325.
4. Knoll M., Cammann K., Dumschat C., Eshold J., Sundermeier C. Sensors and Actuators B. 21:1994;71.
5. Contractor A.Q., Sureshkumar T.N., Narayanan R., Sukeerthi S., Lal R., Srinivasa R.S. Electrochim. Acta. 39:1994;1321.
6. Horowitz G., Peng X., Fichou D., Garnier F. J. Appl. Phys. 67:1990;528.
7. Yang Y., Westeweele E., Zhang C., Smith P., Heeger A.J. J. Appl. Phys. 77:1995;263.
8. Koßmehl G., Niemitz M. Synth. Met. 41:1991;1065.
9. El-Rahman Abd H.A., Schultze J.W. J. Electroanal. Chem. 416:1996;67.
10. Ehrenbeck C., Jüttner K. Electrochim. Acta. 41:1996;1815.
11. Kim E., Xia Y., Whitesides G.M. Adv. Mat. 3:1996;245.
12. Scrinivasan R., Mayne-Banton V. Appl. Phys. Lett. 41:1982;576.
13. Roncali J. Chem. Rev. 92:1992;711.
14. D., Stöckert, Thesis, Düsseldorf, 1992.
15. Krische B., Zagorska H. Synth. Met. 28:1989;C257.
16. Electrochim. Acta. Vol. 42. issue 20-22.
17. Schultze J.W., Jung K.G. Electrochim. Acta. 40:1995;1369.
18. Küpper M., Schultze J.W. Electrochim. Acta. 42:1997;3023.
19. Martin C.R., Parthasarathy R., Menon V. Electrochim. Acta. 39:1994;1309.
20. Borgwarth K., Ricken C., Ebeling D.G., Heinze J. Ber. Bunsenges. Phys. Chem. 99:1995;1421.
21. Wuu Y-M., Fan F-R.F., Bard A.J. J. Electrochem. Soc. 136:1989;885.
22. Frank M.H.T., Denault G. J. Electroanal. Chem. 379:1994;399.
23. Okano M., Itoh K., Fujishima A., Honda K. Chem. Lett. 469:1986.
24. Yoneyama H., Kawai K., Kuwabata S. J. Electrochem. Soc. 134:1988;1699.
25. Yoneyama H., Tokuda M., Kuwabata S. Electrochim. Acta. 39:1994;1315.
26. Cole H.S., Liu Y.S., Philipp H.R. Appl. Phys. Lett. 48:1986;76.
27. Rodriguez I., Gonzales-Velasco J. J. Chem. Soc. Chem. Commun. 387:1990.
28. Decker C. Proc. SPIE Int. Soc. Opt. 112:1989;1022. (laser-assisted process).
29. Jung K.G., Schultze J.W. Synth. Met. 61:1993;185.
30. Hassel A.W., Lohrengel M.M. Electrochim. Acta. 42:1997;3327.
31. Saurbier K., Schultze J.W., Geke J. Electrochim. Acta. 39:1994;1171.
32. Mende G., Fenske F., Flietner H., Jeske M., Schultze J.W. Electrochim. Acta. 39:1994;1259.
33. K.G. Jung, J.W. Schultze, 1993. Ch. Buchal. Nucl. Instr. and Meth. in Physics Res. B. 80/81. 1076.
34. Morgenstern T., Thies A., Schultze J.W. Sensors and Actuators A. 51:1995;103.
35. Jeske M., Jung K.G., Schultze J.W., Thönissen M., Münder H. Surf. Interface Anal. 22:1994;363.
36. Lohrengel M.M. Mater. Sci. Eng. R. 11:1993;243.
37. Morgenstern T., Reier T., Schultze J.W. Electrochem. Soc. Proc. 97-5:1997;166.
38. Jung K.G., Schultze J.W., Robinson K.S., Schmiedel H. Frensenius J. of Anal. Chem. 353:1995;282.
39. Bade K., Karstens O., Michaelis A., Schultze J.W. Faraday Discuss. 94:1992;45.
40. Ehrfeld W., Münchmeyer D. Nucl. Instr. and Meth. in Phys. Res. A. 303:1991;523.
41. Schultze J.W., Lohrengel M.M. Metalloberfläche. 51:1997;735.
42. Karstens O., Schultze J.W., Bacher W., Ruprecht R. Metalloberfläche. 48:1994;148.
43. Lohrengel M.M. Electrochim. Acta. 42:1997;3265.
44. Michaelis, A., Thesis, Düsseldorf, 1994.
45. Schultze J.W. Schweinsberg M. Electrochim. Acta (submitted).
46. Scheller D., Tegtmeier F., Schlue W-R. Electrochim. Acta. 42:1997;3225.
47. Ebling D., Schultze J.W. Metalloberfläche. 44:1990;401.
48. Lohrengel M.M. Ber. Bunsenges. Phys. Chem. 97:1993;440.
49. v.d. Pauw L.J. Phillips Res. Repts. 13:1958;1.
50. Morgenstern T., Schultze J.W. Electrochim. Acta. 42:1997;3057.
51. Winkels S., Lohrengel M.M. Electrochim. Acta. 42:1997;3117.
52. Seidl H., Csepregi L., Heuberger A., Baumgärtl H. J. Electrochem. Soc. 137:1990;3612.
53. Reizman F., van Gelder W. Solid State Electron. 10:1967;625.
54. Schöning M.J., Ronkel F., Crott M., Thust M., Schultze J.W., Kordos P., Lüth H. Electrochim. Acta. 42:1997;3185.
55. Stöckert D., Kessel R., Schultze J.W. Synth. Met. 41:1991;1295.
56. Dunsch L., Rapta P., Neudeck A., Bartel A., Peters R-N., Reinecke E., Apfelstedt I. Synth. Met. 85:1997;1401.
57. Deitrich T.R., Speit B. Schott Information. 70:1994;6.
58. Blasberg Oberflächentechnik GmbH. 08.09.1989. Patent Nr. PCT/EP/89/00204.
59. Schattka D., Winkels S., Schultze J.W. Metalloberfläche. 51:1997;823.
60. Yang R., Evans D.F., Hendrickson W.A. Langmuir. 11:1995;211.
61. Kranz C., Gaub H.E., Schumann W. Adv. Mater. 8:1996;634.
62. Abdoa M., Xie Z.W., Leung A.M., Holdcroft S. Synth. Met. 52:1992;159.
63. Jung K.G., Schultze J.W., Thönissen M., Münder H. Thin Solid Films. 255:1995;317.