Effects of coupling agent thickness on residual stress in polyimide/γ-APS/silicon wafer joints

Journal of Adhesion Science and Technology

Volumn 13, Issue 7, 1999, Pages 805-818

  Kong, D I ^a   Park, C E ^a   Hong, S T ^a   Yang, H C ^a   Kim, K T ^a  

^a Pohang University of Science and Technology (POSTECH)   (South Korea)

Author keywords

APS; Finite element analysis; peel strength; polyimide; residual stress

Indexed keywords

AMINOPROPYLTRIETHOXYSILANE; APS COATING; BENDING STRESS; COATING THICKNESS; FINITE ELEMENT CALCULATIONS; HE-NE LASERS; OXYDIANILINE; PEEL STRENGTH; THIN FILM STRESS;

BOND STRENGTH (MATERIALS); COATINGS; COUPLING AGENTS; FINITE ELEMENT METHOD; POLYIMIDES; SILICON COMPOUNDS; THICKNESS MEASUREMENT; BENDING (DEFORMATION); RESIDUAL STRESSES; SILANES; SILICON WAFERS; STRESS ANALYSIS;

RESIDUAL STRESSES; ADHESION;

AMINOPROPYLTRIETHOXYSILANE; PEEL STRENGTH;

EID: 0032689806     PISSN: 01694243     EISSN: 15685616     Source Type: Journal    
DOI: 10.1163/156856199X01027     Document Type: Article

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