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Materials Science and Engineering: A

Volumn 234-236, Issue , 1997, Pages 1033-1036

A study of dynamic embrittlement in bicrystals of Cu-7%Sn

(5) Muthiah, R C a Pfaendtner, J A a McMahon, C J a Xu, Y a Bassani, J L a

a UNIVERSITY OF PENNSYLVANIA (United States)

Author keywords

Bicrystals; Cu 7 Sn; Diffusion; Dynamic embrittlement; Grain boundary; Intergranular

Indexed keywords

CRACK INITIATION; CRACK PROPAGATION; CRYSTAL ORIENTATION; DIFFUSION IN SOLIDS; EMBRITTLEMENT; GRAIN BOUNDARIES; MATHEMATICAL MODELS; POLYCRYSTALS; THERMAL EFFECTS;

BICRYSTALS; STEADY STATE CRACK GROWTH;

COPPER ALLOYS;

COPPER-TIN ALLOY; DYNAMIC BEHAVIOR; EMBRITTLEMENT;

EID: 0031202537 PISSN: 09215093 EISSN: None Source Type: Journal
DOI: 10.1016/s0921-5093(97)00413-9 Document Type: Article

Times cited : (13)

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