Cobalt silicide thermal stability: From blanket thin film to submicrometer lines

Solid-State Electronics

Volumn 43, Issue 6, 1999, Pages 1039-1044

  Alberti, A ^b   La Via, F ^a   Grimaldi, M G ^b   Ravesi, S ^c  

^a CNR IMETEM   (Italy)

^b UNIVERSITY OF CATANIA   (Italy)

^c STMICROELECTRONICS   (Italy)

Author keywords

[No Author keywords available]

Indexed keywords

ANNEALING; CHEMICAL VAPOR DEPOSITION; ELECTRIC RESISTANCE MEASUREMENT; GRAIN SIZE AND SHAPE; MORPHOLOGY; PYROLYSIS; SEMICONDUCTING SILICON COMPOUNDS; SUBSTRATES; THERMAL EFFECTS; THERMODYNAMIC STABILITY; THIN FILMS; TRANSMISSION ELECTRON MICROSCOPY;

COBALT SILICIDE;

COBALT COMPOUNDS;

EID: 0032672407     PISSN: 00381101     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0038-1101(99)00021-0     Document Type: Article

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