Roughning and smoothing dynamics during KOH silicon etching

Sensors and Actuators, A: Physical

Volumn 74, Issue 1, 1999, Pages 18-23

  Divan, Ralu ^a   Moldovan, N ^a   Camon, H ^b  

^a NATIONAL INSTITUTE FOR RESEARCH AND DEVELOPMENT IN MICROTECHNOLOGIES   (Romania)

^b LAAS CNRS   (France)

Author keywords

[No Author keywords available]

Indexed keywords

ANISOTROPY; SILICON WAFERS; SURFACE ACTIVE AGENTS; SURFACE ROUGHNESS; SURFACES;

ANISOTROPIC ETCHING; SILICON ETCHING; SMOOTHING DYNAMICS;

ETCHING;

EID: 0032665972     PISSN: 09244247     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0924-4247(98)00327-6     Document Type: Article

References (7)

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