Influence of thiourea on the nucleation of copper on polycrystalline platinum

Journal of Applied Electrochemistry

Volumn 29, Issue 5, 1999, Pages 585-591

  Tarallo, A ^a   Heerman, L ^a  

^a UNIVERSITY OF LEUVEN   (Belgium)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER COMPOUNDS; DENSITY (SPECIFIC GRAVITY); DIFFUSION; ELECTRIC POTENTIAL; ELECTRODEPOSITION; ELECTRODES; HYDROGEN INORGANIC COMPOUNDS; NUCLEATION; PLATINUM; POLYCRYSTALLINE MATERIALS; REACTION KINETICS; UREA;

COPPER ADLAYER; INDUCTION PERIOD; POLYCRYSTALLINE PLATINUM; THIOUREA;

COPPER;

EID: 0032661362     PISSN: 0021891X     EISSN: None     Source Type: Journal    
DOI: 10.1023/A:1003410720266     Document Type: Article

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