Mechanical deformation in conductive adhesives as measured with electron-beam moiré

Journal of Electronic Packaging, Transactions of the ASME

Volumn 121, Issue 2, 1999, Pages 69-74

  Drexler, E S ^a   Berger, J R ^b  

^a NATIONAL INSTITUTE OF STANDARDS AND TECHNOLOGY   (United States)

^b Department of Geology and Geological Engineering   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVES; CONDUCTIVE MATERIALS; DEFORMATION; ELECTRON BEAMS; MECHANICAL TESTING; SHEAR STRESS;

CONDUCTIVE ADHESIVES; ELECTRON BEAM MOIRE;

ELECTRONICS PACKAGING;

EID: 0032652093     PISSN: 10437398     EISSN: 15289044     Source Type: Journal    
DOI: 10.1115/1.2792670     Document Type: Article

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