Electron-beam moire study of local deformation in conductive adhesives

Materials Research Society Symposium - Proceedings

Volumn 445, Issue , 1997, Pages 75-80

  Drexler, E S ^a   Berger, J R ^a  

^a NATIONAL INSTITUTE OF STANDARDS AND TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CONDUCTIVE MATERIALS; COPPER; CURING; DEFORMATION; ELECTRON BEAMS; GLASS TRANSITION; INTERFACES (MATERIALS); LITHOGRAPHY; SCANNING ELECTRON MICROSCOPY; STRAIN MEASUREMENT; THERMAL EFFECTS; THERMAL EXPANSION;

CONDUCTIVE ADHESIVES; ELECTRON BEAM MOIRE;

ADHESIVES;

EID: 0031378534     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (6)