Finite element analysis for the characteristics of temperature and stress in micro-machining considering the size effect

International Journal of Machine Tools and Manufacture

Volumn 39, Issue 9, 1999, Pages 1507-1524

  Kim, Kug Weon ^a   Lee, Woo Young ^b   Sin, Hyo Chol ^c  

^a LG Electronics Inc   (South Korea)

^b Korea University   (South Korea)

^c Seoul National University   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; COPPER; FINITE ELEMENT METHOD; FRICTION; METAL CUTTING; STRAIN RATE; STRESS CONCENTRATION; TEMPERATURE DISTRIBUTION;

CHIP TOOL CONTACT SURFACE; CUTTING FORCE; SIZE EFFECT;

MICROMACHINING;

EID: 0032650378     PISSN: 08906955     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0890-6955(98)00071-6     Document Type: Article

References (13)

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