Effect of residual stress on adhesion of silicon-containing diamond-like carbon coatings

Thin Solid Films

Volumn 345, Issue 2, 1999, Pages 200-207

  Wu, Weng Jin ^a   Hon, Min Hsiung ^a  

^a Dept Mat Sci Eng ^*  (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; CARBON; COMPRESSIVE STRESS; GLASS; PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION; RESIDUAL STRESSES; SILICON WAFERS; STRESS ANALYSIS; THERMAL STRESS;

TENSILE FAILURE MODES;

DIAMOND FILMS;

EID: 0032628641     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0040-6090(98)01052-9     Document Type: Article

References (39)

1. Oral B., Ernse K.H., Schmutz C.J. Diamond Rel. Mater. 5:1996;932.
2. Matthews A., Eskildsen S.S. Diamond Rel. Mater. 3:1994;902.
3. Oguri K., Arai T. Surf. Coat. Technol. 47:1991;710.
4. Martino C.D., Demichelis F., Tagliaferro A. Diamond Rel. Mater. 3:1994;547.
5. Liu Y., Erdemir A., Meletis E.I. Surf. Coat. Technol. 82:1996;48.
6. Silva S.R.P., Kapoor A., Amaratunga G.A.J. Surf. Coat. Technol. 73:1995;132.
7. Oettel H., Wiedemann R. Surf. Coat. Technol. 76/77:1995;265.
8. Roth Th., Kloos K.H., Broszeit E. Thin Solid Films. 153:1987;123.
9. Bull S.J., Jones A.M., McCabe A.R. Surf. Coat. Technol. 54/55:1992;173.
10. Lin C.H., Wang H.L., Hon M.H. Thin Solid Films. 283:1996;171.
11. Burnett P.J., Rickerby D.S. Thin Solid Films. 154:1987;403.
12. Steinmann P.A., Tardy Y., Hintermann H.E. Thin Solid Films. 154:1987;333.
13. Lelogeais M., Ducarroir M. Surf. Coat. Technol. 48:1991;121.
14. Kleer G., Kassner R., Meyer E.M., Schinker M.G., Doell W. Surf. Coat. Technol. 54/55:1992;167.
15. Bhusari D.M., Kshirsahar S.T. J. Appl. Phys. 73:1993;1743.
16. Couderc P., Catherine Y. Thin Solid Films. 146:1987;93.
17. Sun Z., Sun Y., Yang Q., Wang X., Zheng Z. Surf. Coat. Technol. 79:1996;108.
18. Tallant D.R., Parmeter J.E., Siegal M.P., Simpson R.L. Diamond Rel. Mater. 4:1995;191.
19. Herrmans H., Grevendonk W. Phil. Mag. B. 66:1992;787.
20. Wieder H., Cardona M., Guarnieri C.R. Phys. Stat. Sol. 92:1979;99.
21. Mckenzie D.R. J. Phys. D. 18:1985;1935.
22. Ray S., Das D., Barua A.K. Solar Energy Mater. 15:1987;45.
23. Nadler M.P., Donovan T.M., Green A.K. Thin Solid Films. 116:1984;241.
24. Demichelis F., Crovini G., Pirri C.F., Tresso E. Phil. Mag. B. 68:1993;329.
25. Katayama Y., Usami K., Shimada T. Phil. Mag. B. 43:1981;283.
26. Tuinstraa F., Koening J.L. J. Chem. Phys. 53:(3):1970;1126.
27. G.M. Rosenblatt, D.K. Veirs, 6th Int. Conf. on High Temperature-Chemistry of Inorganic Materials, 1989, p. 31.
28. Cho N.H., Veirs D.K., Ager J.W. III, Rubin M.D., Hopper C.B., Bogy D.B. J. Appl. Phys. 71:1992;2243.
29. Wu W.J., Hon M.H. Thin Solid Films. 307:1997;1.
30. Takeshita T., Kurata Y., Hasegawa S. J. Appl. Phys. 71:1992;5395.
31. Kuwahara K., Sumogogi T., Kondo M. Thin Solid Films. 78:1981;41.
32. Shinzato S., Sumogogi T., Konfune S., Kuwahara K. Thin Solid Films. 97:1982;333.
33. Park J.H., Kwon H.S., Lee J.Y. J. Appl. Phys. 72:1992;5246.
34. Guivarch A., Richard J., LeContellec M., Ligeon E., Fontenille J. J. Appl. Phys. 51:1980;2167.
35. Windischmann H. J. Appl. Phys. 62:1987;1800.
36. Takahashi H., Nagata H., Kataoka H., Takai H. J. Mater. Res. V10:1995;2736.
37. Knotek O., Elsing R., Krämer G., Jungblut F. Surf. Coat. Technol. 46:1991;265.
38. Chalker P.R., Bull S.J., Rickerby D.S. Mater. Sci. Eng. A. 140:1991;583.
39. Arai T., Fujita H., Watanabe M. Thin Solid Films. 154:1987;387.