Structure and adhesive properties of TiN films reactively deposited by plasma-free sputtering

Thin Solid Films

Volumn 343-344, Issue 1-2, 1999, Pages 273-276

  Takahashi, Takakazu ^a   Masugata, Katsumi ^a   Iwatsubo, Satoshi ^b   Asada, Mineo ^b  

^a UNIVERSITY OF TOYAMA   (Japan)

^b TOYAMA INDUSTRIAL TECHNOLOGY CENTER   (Japan)

Author keywords

Adhesion; Crystal structure; Hard coating; Scratch test; Sputtering; TiN

Indexed keywords

ADHESION; CRYSTAL ORIENTATION; ELECTRIC CONDUCTIVITY OF SOLIDS; PROTECTIVE COATINGS; SPUTTER DEPOSITION; STOICHIOMETRY; SUBSTRATES; THERMAL EFFECTS; TITANIUM NITRIDE; TOOL STEEL; X RAY CRYSTALLOGRAPHY;

HARD COATINGS; SCRATCH TESTS;

CERAMIC COATINGS;

EID: 0032623618     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0040-6090(98)01678-2     Document Type: Article

References (3)

1. H. Yumoto. K. Kaneko, M. Ishihara, Y. Kato, K. Akashi, Thin Solid Films 281 (1996) 311.
2. M. Yamazato, Y. Yamagata, T. Regami, K. Ebihara, Proc. 4th Int. Symp. Sputtering Plasma Processes, 1997 635.
3. Y. Kitamoto, M. Abe, M. Naoe, IEEE Trans. Magn. 32 (5) (1996) 4547.