Stress effects in the oxidation of planar silicon substrates

Applied Physics Letters

Volumn 74, Issue 14, 1999, Pages 1981-1983

  Mihalyi, A ^a   Jaccodine, R J ^b   Delph, T J ^b  

^a UNIVERSITY OF PENNSYLVANIA   (United States)

^b LEHIGH UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BENDING (DEFORMATION); COMPRESSIVE STRESS; OXIDATION; REACTION KINETICS; STRESS ANALYSIS; TENSILE STRESS;

FOUR-POINT BENDING TESTS;

SILICON WAFERS;

EID: 0032615487     PISSN: 00036951     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.123720     Document Type: Article

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