A modified multi-chemical spray cleaning process for post shallow trench isolation chemical mechanical polishing cleaning application

Thin Solid Films

Volumn 332, Issue 1-2, 1998, Pages 385-390

  Wang, Y L ^a   Wang, T C ^b   Wu, J ^a   Tseng, W T ^a   Lin, C F ^c  

^a Taiwan Semiconductors Manufacturing Company   (Taiwan)

^b NATIONAL CHIAO TUNG UNIVERSITY   (Taiwan)

^c NATIONAL CHENG KUNG UNIVERSITY   (Taiwan)

Author keywords

Chemical mechanical polishing; Multi chemicals spray cleaning; Post CMP cleaning; Shallow trench isolation

Indexed keywords

AMMONIA; HEATING; PEROXIDES; SPRAYING;

CHEMICAL MECHANICAL POLISHING (CMP); SHALLOW TRENCH ISOLATION (STI);

CHEMICAL POLISHING;

EID: 0032476291     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0040-6090(98)01207-3     Document Type: Article

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