Carrier gas effects on the selectivity in chemical vapor deposition of copper

Thin Solid Films

Volumn 315, Issue 1-2, 1998, Pages 229-237

  Kim, Seok ^a   Park, Jong Man ^a   Choi, Doo Jin ^a  

^a Yonsei University   (South Korea)

Author keywords

Chemical vapor deposition; Copper; Hydrogen; Metallization

Indexed keywords

ADSORPTION; ALUMINUM; CHEMICAL VAPOR DEPOSITION; COPPER; ELECTRIC CONDUCTIVITY OF SOLIDS; HYDROGEN; METALLIZING; MORPHOLOGY; SILICA; TITANIUM NITRIDE;

PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION (PECVD);

METALLIC FILMS;

EID: 0032473224     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0040-6090(97)00684-6     Document Type: Article

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