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Volumn 4, Issue 5, 1998, Pages 1033-1039

Mechanical properties and microstructures of Al-Cu thin films with various heat treatments

Author keywords

Aluminum copper alloy; Dislocation; Hardening; Precipitation; Thin film

Indexed keywords

AGE HARDENING; ALUMINUM COPPER ALLOYS; BINARY ALLOYS; DISLOCATIONS (CRYSTALS); HARDENING; HARDNESS; HEAT TREATMENT; METALLIC FILMS; MICROSTRUCTURE; PRECIPITATION (CHEMICAL);

EID: 0032418768     PISSN: 12259438     EISSN: None     Source Type: Journal    
DOI: 10.1007/bf03025973     Document Type: Article
Times cited : (4)

References (15)
  • 7
    • 0030382159 scopus 로고    scopus 로고
    • eds., W. F. Filter et al., MRS Symp. Proc., Pittsburgh, PA
    • A. G. Dirks, in Materials Reliability in Microelectronics VI (eds., W. F. Filter et al.), vol. 428, p. 201, MRS Symp. Proc., Pittsburgh, PA (1996).
    • (1996) Materials Reliability in Microelectronics VI , vol.428 , pp. 201
    • Dirks, A.G.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.