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Volumn 4, Issue 5, 1998, Pages 1033-1039
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Mechanical properties and microstructures of Al-Cu thin films with various heat treatments
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Author keywords
Aluminum copper alloy; Dislocation; Hardening; Precipitation; Thin film
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Indexed keywords
AGE HARDENING;
ALUMINUM COPPER ALLOYS;
BINARY ALLOYS;
DISLOCATIONS (CRYSTALS);
HARDENING;
HARDNESS;
HEAT TREATMENT;
METALLIC FILMS;
MICROSTRUCTURE;
PRECIPITATION (CHEMICAL);
COMPRESSIVE YIELD STRESS;
DENSITY OF DISLOCATION;
LOWER TEMPERATURES;
MICROSTRUCTURE AND MECHANICAL PROPERTIES;
PROPERTIES AND MICROSTRUCTURES;
SOLID SOLUTION HARDENING;
STRESS TEMPERATURE;
SUBSTRATE CURVATURE;
THIN FILMS;
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EID: 0032418768
PISSN: 12259438
EISSN: None
Source Type: Journal
DOI: 10.1007/bf03025973 Document Type: Article |
Times cited : (4)
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References (15)
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