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Volumn 145, Issue 12, 1998, Pages 4327-4332
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Very low pressure selective aluminum chemical vapor deposition using dimethylaluminum hydride without H2 carrier gas
a
a
NTT CORPORATION
(Japan)
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Author keywords
[No Author keywords available]
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Indexed keywords
ALUMINUM;
ALUMINUM COMPOUNDS;
FILM GROWTH;
HYDRIDES;
HYDROGEN;
INTEGRATED CIRCUIT MANUFACTURE;
MORPHOLOGY;
PYROLYSIS;
SURFACE CHEMISTRY;
VERY LOW PRESSURE SELECTIVE ALUMINUM CHEMICAL VAPOR DEPOSITION;
CHEMICAL VAPOR DEPOSITION;
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EID: 0032300407
PISSN: 00134651
EISSN: None
Source Type: Journal
DOI: 10.1149/1.1838959 Document Type: Article |
Times cited : (5)
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References (13)
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