Towards real-time fault identification in plasma etching using neural networks

Intelligent Engineering Systems Through Artificial Neural Networks

Volumn 1998, Issue , 1998, Pages 803-810

  Zhang, Benyong ^a   May, Gary ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

APPLICATION SPECIFIC INTEGRATED CIRCUITS; CMOS INTEGRATED CIRCUITS; DATA ACQUISITION; MATHEMATICAL MODELS; PATTERN RECOGNITION; PLASMA ETCHING; REAL TIME SYSTEMS; SILICON WAFERS; TIME SERIES ANALYSIS;

REAL TIME FAULT IDENTIFICATION; REAL TIME MEASUREMENTS;

NEURAL NETWORKS;

EID: 0032294507     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (6)

1. Almgren, C., "The Role of Measurements in Plasma Etching," Semi. International, vol. 20, no. 8, 1997.
2. Baker, M., Himmel, C., and May, G., "Time Series Modeling of Reactive Ion Etching Using Neural Networks," IEEE Trans. Semi. Manufac., vol. 8, no. 1, Feb., 1995.
3. Bakshi, V., "Benchmarking of Commercial Software for Fault Detection and Classification (FDC) of Plasma Etchers for Semiconductor Manfuacturing Equipment," Proc. 1997 American Control Conf., vol. III, June, 1997.
4. Montgomery, D., Introduction to Statistical Quality Control, New York: Wiley, 1991.
5. Singer, P., "A New Focus on Equipment Effectiveness," Semi. International, vol. 19, no. 1, 1996.
6. Spanos, C., Guo, H., Miller, A., and Levine-Parrill, J., "Real-Time Statistical Process Control Using Tool Data," IEEE Trans. Semi. Manufac., vol. 5, no. 4, Nov. 1992.