Rebuttal to: A critique of the Reliability-Analysis-Center failure-rate-model for plastic encapsulated microcircuits

IEEE Transactions on Reliability

Volumn 47, Issue 4, 1998, Pages 419-424

  Denson, William K ^a,b  

^a Reliability Analysis Center   (Italy)

^b Reliability Analysis Center   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

PLASTIC ENCAPSULATED MICROCIRCUITS (PEM); UNCERTAINTY ANALYSIS;

FAILURE ANALYSIS; MATHEMATICAL MODELS; RELIABILITY;

ELECTRIC NETWORK ANALYSIS;

EID: 0032258865     PISSN: 00189529     EISSN: None     Source Type: Journal    
DOI: 10.1109/TR.1998.756084     Document Type: Article

References (5)

1. N. Sinnadurai, A. Shukla, M.G. Pecht, "A critique of the Reliability-Analysis-Center failure-rate-model for plastic encapsulated microcircuits", IEEE Trans. Reliability, vol 47, 1998 Jun, pp HO - 113.
2. W. Denson, J. Farrell, D. Nicholls, Reliable Application of Plastic Encapsulated Microcircuits, RAC publication #PEM2, 1996 Jan.
3. W. Denson, P. Brusius, VHS1C and VHSIC-Like Reliability Modeling, RADC- TR.-89-177, 1989 Oct.
4. Reliability Prediction Methodologies for Electronic Equipment, AIR. 5286, SÄE G-11 Committee, Electronic Reliability Prediction Committee, 1998 Jan 31; Society of Automotive Engineers.
5. W. Denson, S.J. Keene, J. Caroli, "A new systemreliability assessment methodology", Proc. Reliability and Maintainability Symp, 1998, pp 413 - 420.