SCOPUS 정보 검색 플랫폼

Proceedings - 4th International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces

Volumn 1998-March, Issue , 1998, Pages 111-116

Soft error rates in solder bumped packaging

(1) Roberson, Mark W a

a MCNC (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ALPHA PARTICLES; FLIP CHIP DEVICES; INTERFACES (MATERIALS); LEAD ALLOYS; PACKAGING; RADIATION HARDENING; RADIOACTIVE ELEMENTS; SOLDERING; TIN ALLOYS; ELECTRON EMISSION; ERRORS; LEAD COMPOUNDS; MICROPROCESSOR CHIPS; SOLDERING ALLOYS;

HEALTH CONCERNS; MEASUREMENTS OF; OPERATIONAL LIFE; PARTICLE EMISSIONS; RADIATION-INDUCED; RADIOACTIVE DECAY; SOFT ERROR RATE; SOLDER BUMPING;

PACKAGING MATERIALS; ELECTRONICS PACKAGING;

ALPHA PARTICLE EMISSION; SOFT ERROR RATES; SOLDER BUMPED PACKAGING;

EID: 0032230443 PISSN: None EISSN: None Source Type: Conference Proceeding
DOI: 10.1109/ISAPM.1998.664444 Document Type: Conference Paper

Times cited : (9)

References (9)

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