Multichip module integration technology for high-speed analog and digital applications

Conference Proceedings of the International Symposium on Signals, Systems and Electronics

Volumn , Issue , 1998, Pages 91-96

  Mangold, T ^a   Wolf, J ^a   Toepper, M ^a   Reichl, H ^a   Russer, P ^a  

^a TECHNICAL UNIVERSITY OF MUNICH   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

BARE DICE; CYCLOTENE; ELECTROMAGNETIC FULL WAVE MODELING; MULTICHIP MODULE INTEGRATION TECHNOLOGY; POLYIMID PYRALIN;

COPPER PLATING; DIELECTRIC MATERIALS; METALLIZING; SEMICONDUCTING POLYMERS; SEMICONDUCTOR DEVICE MANUFACTURE; SEMICONDUCTOR DEVICE MODELS; SPUTTERING; SUBSTRATES; THIN FILMS;

MULTICHIP MODULES;

EID: 0032217965     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (8)

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2. J. Böck, A. Felder, et al. A 50 GHz implated base silicon bipolar technology with 35 GHz static frequency divider. In VLSI Technology Symposium, 1996.
3. J. Wolf, F.J. Schmückle, et al. System integration for high frequency applications. In Proceedings ISHM97, Philadelphia, October 1997.
4. M. Töpper and J. Wolf. MCM-D with embedded active and passive components. In Proceedings ISHMC 96, Minneapolis, October 1996.
5. P.B. Johns. A symmetrical condesnsed node for the tlm method. IEEE Trans. Microwave Theory Tech, 35:370-377, 1987.
6. B. Isele and P. Russer. Improved skin effect model in TLM. In COMPUMAG, Miami, Florida, 31. Oktober-. November 1993.
7. J. Rebel and P. Russer. Modelling of dispersive media in TLM using the propagator approach. In Proc. ACES, volume 1, pages 336-343, 1998.
8. T. Mangold and P. Russer. Generation of lumped element equivalent circuits from time-domain scattering signals. In Proc. ACES, volume 1, pages 351-358, March 1998.