Space power technology in power management and distribution electronics

Journal of Spacecraft and Rockets

Volumn 35, Issue 6, 1998, Pages 837-844

  Reinhardt, Kitt C ^a   Mayberry, Clay S ^a   Glaister, Dave S ^b  

^a AIR FORCE RESEARCH LABORATORY   (United States)

^b AEROSPACE CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CHARGING (BATTERIES); ELECTRIC POWER SUPPLIES TO APPARATUS; ELECTRIC POWER SYSTEM PROTECTION; ELECTRONICS PACKAGING; ENERGY EFFICIENCY; FUEL CELLS; POWER CONTROL; POWER CONVERTERS; POWER ELECTRONICS; SOLAR CELL ARRAYS;

FAULT PROTECTION DEVICES; POWER MANAGEMENT; SOLAR ARRAY POWER REGULATION DEVICES;

SATELLITES;

EID: 0032208350     PISSN: 00224650     EISSN: 15336794     Source Type: Journal    
DOI: 10.2514/2.3407     Document Type: Article

References (6)

1. McVey, M. J., and Rumsey, D. L., "Power Management and Distribution Study," The Aerospace Corp., Aerospace Rept. TOR-94(4524)-2, U.S. Air Force Contract No. F04502-93-C-0094, El Segundo, CA, May 1994.
2. Keener, D., Donet, C., and Schuller, M., "Power Subsystem Technologies for Space Based Radar," IEEE Aerospace Conference Proceedings, Vol. 2, Feb. 1997, pp. 113-126.
3. Lyke, J., and Wojnarowski, R., "Three Dimensional Patterned Overlay High Density Interconnect (HDI) Technology," Journal of Microelectronic Systems Integration, Vol. 1, No. 2, July 1993.
4. Reinhardt, K. C., and Marciniak, M. A., "Wide-Bandgap Power Electronics for the More Electric Aircraft," Proceedings of the Intersociety Energy Conversion Conference, Vol. 1, Conf. 31, pp. 127-131.
5. Zipperian, T. E., Dreike, P. L., Fleetwood, D. M., King, D. B., and Sprauer, D. C., "An Overview of High-Temperature Electronic Device Technologies and Potential Applications," IEEE Transactions on Components Packaging and Manufacturing Technology, Pt. A, Vol. 17, No. 4, 1994, pp. 594-609.
6. Casady, J. B., and Johnson, R. W., "Status of Silicon-Carbide (SiC) as a Wide-Bandgap Semiconductor for High-Temperature Applications: A Review," Solid-State Electronics, Vol. 39, No. 10, 1996, pp. 1409-1422.