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Volumn , Issue , 1996, Pages 50-57
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Characterizing the commercial avionics thermal environment for field reliability assessment
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Author keywords
[No Author keywords available]
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Indexed keywords
ALGORITHMS;
AVIONICS;
ELECTRONICS ENGINEERING;
FATIGUE TESTING;
PRINTED CIRCUIT BOARDS;
RELIABILITY;
SOLDERED JOINTS;
THERMAL EFFECTS;
VISCOPLASTICITY;
RAINFLOW CYCLE COUNTING;
ENVIRONMENTAL TESTING;
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EID: 0030314495
PISSN: 00739227
EISSN: None
Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper |
Times cited : (5)
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References (8)
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