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Volumn , Issue , 1996, Pages 50-57

Characterizing the commercial avionics thermal environment for field reliability assessment

Author keywords

[No Author keywords available]

Indexed keywords

ALGORITHMS; AVIONICS; ELECTRONICS ENGINEERING; FATIGUE TESTING; PRINTED CIRCUIT BOARDS; RELIABILITY; SOLDERED JOINTS; THERMAL EFFECTS; VISCOPLASTICITY;

EID: 0030314495     PISSN: 00739227     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper
Times cited : (5)

References (8)
  • Reference 정보가 존재하지 않습니다.

* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.