Influence of pad geometry on ceramic ball grid array solder joint reliability

Proceedings of the IEEE/CPMT International Electronic Manufacturing Technology (IEMT) Symposium

Volumn , Issue , 1996, Pages 267-273

  Yee, Shelgon ^a   Ladhar, Harjinder ^a  

^a Solectron Corp   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CERAMIC MATERIALS; ELECTRONICS PACKAGING; GEOMETRY; RELIABILITY; SOLDERED JOINTS; SOLDERING; SUBSTRATES; SURFACE MOUNT TECHNOLOGY; THERMAL EXPANSION;

CERAMIC BALL GRID ARRAY (CBGA); HOT AIR SOLDER LEVELING (HASL); PAD GEOMETRIES; SURFACE FINISH;

PRINTED CIRCUIT BOARDS;

EID: 0030401561     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (8)