Conductive polymers for microelectronic packaging: Chip bonding to polymer films

Polymers for Advanced Technologies

Volumn 9, Issue 10-11, 1998, Pages 806-811

  Küchenmeister, Frank ^a   Böttcher, Matthias ^a,c   Meusel, Ekkehard ^a   Meier, Dieter ^b  

^a DRESDEN UNIVERSITY OF TECHNOLOGY   (Germany)

^b LPKF Laser and Electronics GmbH   (Germany)

^c IBM MICROELECTRONICS   (United States)

Author keywords

Chip bonding; Conductive polymers; Excimer laser micromachining; Microelectronic packaging; Polyimide film

Indexed keywords

AUGER ELECTRON SPECTROSCOPY; BONDING; ELECTRIC VARIABLES MEASUREMENT; ELECTRONICS PACKAGING; ELECTROPLATING; INTEGRATED CIRCUITS; METALLIZING; MICROELECTRONIC PROCESSING; MICROMACHINING; POLYIMIDES; SCANNING ELECTRON MICROSCOPY; X RAY PHOTOELECTRON SPECTROSCOPY;

CHIP BONDING; CURRENT VOLTAGE CURVE; EXCIMER LASER MICROMACHINING; WET CHEMICAL METALLIZATION;

CONDUCTIVE PLASTICS;

EID: 0032181379     PISSN: 10427147     EISSN: None     Source Type: Journal    
DOI: 10.1002/(SICI)1099-1581(1998100)9:10/11<806::AID-PAT824>3.0.CO;2-8     Document Type: Article

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