Analysis of 3D conjugate heat transfers in electronics

Proceedings of European Design and Test Conference

Volumn , Issue , 1997, Pages 190-194

  Fradin, J P ^a   Molla, L ^a   Desaunettes, B ^a  

^a Epsilon Ingenierie California V 5   (France)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SOFTWARE; FINITE VOLUME METHOD; HEAT TRANSFER; INTEGRATED CIRCUIT TESTING; REAL TIME SYSTEMS;

REAL THREE DIMENSIONAL CONJUGATE HEAT TRANSFER;

MULTICHIP MODULES;

EID: 0030651954     PISSN: 10661409     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (7)